Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
307GI-03LF
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
时钟驱动器及分配 SERIAL PROGRAMMABLE CLOCK SOURCE
|
||
307GI-03LFT
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
Clock Drivers & Distribution SERIAL PROGRAMMABLE CLOCK SOURCE
|
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