Technical parameters/access time: 5 ns
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: LBGA-100
External dimensions/length: 11.0 mm
External dimensions/width: 11.0 mm
External dimensions/packaging: LBGA-100
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 完全替代 | LBGA-100 |
FIFO, 8KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11MM, 1MM PITCH, GREEN, BGA-100
|
||
SN74V263-6GGM
|
TI | 功能相似 | BGA-100 |
8192 】 18 , 16384 】 18 , 32768 】 18 :65536 】 18 3.3 V的CMOS先入先出MEMORIES 8192 】 18, 16384 】 18, 32768 】 18, 65536 】 18 3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES
|
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