Technical parameters/access time: 4 ns
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Technical parameters/power supply voltage (Max): 3.45 V
Technical parameters/power supply voltage (Min): 3.15 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: LBGA-100
External dimensions/length: 11 mm
External dimensions/width: 11 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: LBGA-100
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72V243L6BC
|
Integrated Device Technology | 功能相似 |
3.3伏高密度SUPERSYNC窄总线FIFO 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO
|
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