Technical parameters/access time: 5 ns
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: LBGA-100
External dimensions/length: 11.0 mm
External dimensions/width: 11.0 mm
External dimensions/packaging: LBGA-100
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V2113L7-5BC
|
Renesas Electronics | 完全替代 | CABGA-100 |
256K x 18 / 512K x 9 SuperSync II FIFO, 3.3V
|
||
72V2113L7-5BCI
|
Integrated Device Technology | 完全替代 | LBGA-100 |
先进先出 256Kx18 /512Kx9 3.3V SUPERSYNC II 先进先出
|
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