Technical parameters/access time: 6.5 ns
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TQFP-64
External dimensions/length: 14.0 mm
External dimensions/width: 14.0 mm
External dimensions/packaging: TQFP-64
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V851L10PF
|
Integrated Device Technology | 完全替代 | LQFP-64 |
FIFO Mem Sync Quad Depth/Width Bi-Dir 8K x 9 x 2 64Pin TQFP Tray
|
||
72V851L10PFG8
|
Integrated Device Technology | 完全替代 | LQFP-64 |
Bi-Directional FIFO, 8KX9, 6.5ns, Synchronous, CMOS, PQFP64, GREEN, PLASTIC, TQFP-64
|
||
72V851L10TFG
|
Integrated Device Technology | 完全替代 | TQFP-64 |
先进先出 3.3V DUAL 8K X 9 SYNC先进先出
|
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