Technical parameters/access time: 15 ns
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TFSOP-56
External dimensions/length: 14 mm
External dimensions/width: 6.1 mm
External dimensions/height: 1 mm
External dimensions/packaging: TFSOP-56
External dimensions/thickness: 1.00 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7285L15PAGI
|
Integrated Device Technology | 类似代替 | TFSOP-56 |
FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 x 2 56Pin TSSOP Tube/Tray
|
||
72V85L15PA8
|
Integrated Device Technology | 完全替代 | TFSOP-56 |
先进先出 8Kx9 ASYNCHRONOUS DUAL 先进先出 3.3V
|
||
72V85L15PAG
|
Integrated Device Technology | 完全替代 | TSSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ，双1024× 9双2048 ×9 ，双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
||
72V85L15PAG
|
Renesas Electronics | 完全替代 | TFSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ，双1024× 9双2048 ×9 ，双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
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