Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TQFP-64
External dimensions/length: 10 mm
External dimensions/width: 10 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: TQFP-64
External dimensions/thickness: 1.40 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review