Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TQFP-64
External dimensions/length: 14 mm
External dimensions/width: 14 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: TQFP-64
External dimensions/thickness: 1.40 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72265LA10TFG
|
Integrated Device Technology | 功能相似 | LQFP-64 |
先进先出 16K X 18 SUPER SYNC 先进先出
|
||
72V265LA10TFG
|
Integrated Device Technology | 类似代替 | TQFP-64 |
FIFO, 16KX18, 6.5ns, Synchronous, CMOS, PQFP64, GREEN, SLIM, TQFP-64
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review