Technical parameters/power supply voltage: 3.135V ~ 3.465V
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: TBGA-165
External dimensions/length: 15.0 mm
External dimensions/width: 13.0 mm
External dimensions/packaging: TBGA-165
External dimensions/thickness: 1.20 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71V65703S85BQ8
|
Integrated Device Technology | 完全替代 | TBGA-165 |
3.3V 256K x 36 ZBT Synchronous 3.3V I/O Flowthrough SRAM
|
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