Technical parameters/power supply voltage: 2.375V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: TQFP-100
External dimensions/length: 20.0 mm
External dimensions/width: 14.0 mm
External dimensions/packaging: TQFP-100
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71T75602S133PFG
|
Integrated Device Technology | 完全替代 | TQFP-100 |
SRAM Chip Sync Single 2.5V 18M-Bit 512K x 36 4.2ns 100Pin TQFP
|
||
71T75602S133PFGI
|
Renesas Electronics | 完全替代 | TQFP-100 |
SRAM Chip Sync Single 2.5V 18M-Bit 512K x 36 4.2ns 100Pin TQFP Tray
|
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