Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LT3024EDE#PBF
|
Linear Technology | 功能相似 | DFN-12 |
LINEAR TECHNOLOGY LT3024EDE#PBF 芯片, 稳压器, LDO, 双路, 可调, 0.3VDO, 0.5A, 12DFN
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review