Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/length: 17.0 mm
External dimensions/width: 17.0 mm
External dimensions/packaging: LBGA-256
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70T3339S133BCI
|
Integrated Device Technology | 功能相似 | CABGA-256 |
静态随机存取存储器 512K X 18 DP
|
||
|
|
Renesas Electronics | 类似代替 | CABGA-256 |
SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 256Pin CABGA Tray
|
||
70T633S10BCI
|
Integrated Device Technology | 类似代替 | LBGA-256 |
SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 256Pin CABGA Tray
|
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