Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: TQFP-100
External dimensions/length: 14.0 mm
External dimensions/width: 14.0 mm
External dimensions/packaging: TQFP-100
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70V261L25PFG
|
Integrated Device Technology | 完全替代 | TQFP-100 |
静态随机存取存储器 16Kx16,3.3V DUAL- PORT RAM w/INT
|
||
70V261L25PFGI
|
Integrated Device Technology | 完全替代 | TQFP-100 |
SRAM, 256 Kbit, 16K x 16位, 3V 至 3.6V, TQFP, 100 引脚, 25 ns
|
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