Technical parameters/power supply voltage: 2.4V ~ 2.6V
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: CABGA-256
External dimensions/length: 17 mm
External dimensions/width: 17 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: CABGA-256
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70T3339S133BCI
|
Integrated Device Technology | 完全替代 | CABGA-256 |
静态随机存取存储器 512K X 18 DP
|
||
|
|
Renesas Electronics | 完全替代 | CABGA-256 |
SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 256Pin CABGA Tray
|
||
70T633S10BCI
|
Integrated Device Technology | 完全替代 | LBGA-256 |
SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 256Pin CABGA Tray
|
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