Technical parameters/number of rows: 2
Encapsulation parameters/installation method: Through Hole
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
68021-172HLF
|
Future Communications IC | 完全替代 |
2.54mm 方针
|
|||
68021-172HLF
|
AFCI | 完全替代 |
2.54mm 方针
|
|||
68021-172HLF
|
FCI Electronics | 完全替代 |
2.54mm 方针
|
|||
68021-172HLF
|
Amphenol ICC | 完全替代 |
2.54mm 方针
|
|||
|
|
Amphenol ICC | 完全替代 |
AMPHENOL FCI 68021-272HLF Board-To-Board Connector, 2.54mm, 72Contacts, Header, BergStik II 68021 Series, Through Hole
|
|||
68021-272HLF
|
Future Communications IC | 完全替代 |
AMPHENOL FCI 68021-272HLF Board-To-Board Connector, 2.54mm, 72Contacts, Header, BergStik II 68021 Series, Through Hole
|
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