Technical parameters/number of rows: 2
Encapsulation parameters/installation method: Through Hole
Other/Product Category: Headers
Other/RoHS: Non-Compliant
Other/Bitch: 2.54 mm
Other/Number of Positions/Contacts: 30
Other/Number of Rows: 2
Other/Contact Plating: Gold or GXT
Other/Matching Style: Through Hole
Other/Determination Style: Solder Tail
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSW-115-07-T-D
|
Samtec | 功能相似 | - |
板至板连接, 2.54 mm, 30 触点, 针座, TSW Series, 通孔安装, 2 排
|
||
TSW-115-26-T-D
|
Samtec | 类似代替 | - |
SAMTEC TSW-115-26-T-D Board-To-Board Connector, 2.54mm, 30Contacts, Header, TSW Series, Through Hole, 2Rows
|
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