Technical parameters/number of rows: 2
Encapsulation parameters/installation method: Through Hole
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
67996-472HLF
|
FCI Electronics | 完全替代 |
AMPHENOL FCI 67996-472HLF 连接器
|
|||
TSW-136-09-G-D
|
Samtec | 类似代替 |
SAMTEC TSW-136-09-G-D Board-To-Board Connector, 2.54mm, 72Contacts, Header, TSW Series, Through Hole, 2Rows
|
|||
TSW-136-11-T-D
|
Samtec | 类似代替 |
板至板连接, 垂直, 2.54 mm, 72 触点, 针座, TSW系列, 通孔安装, 2 排
|
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