Technical parameters/Contact electroplating: Gold
Technical parameters/number of rows: 2
Technical parameters/number of pins: 10
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag, Tube
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
67997-110HLF
|
Future Communications IC | 完全替代 |
AMPHENOL FCI 67997-110HLF 板至板连接器, 公, 10路, 2排
|
|||
67997-210HLF
|
Amphenol | 完全替代 | 间距P=2.54mm |
AMPHENOL FCI 67997-210HLF 板至板连接器, 针座, 10路, 2排
|
||
|
|
Amphenol ICC | 完全替代 |
AMPHENOL FCI 67997-210HLF 板至板连接器, 针座, 10路, 2排
|
|||
|
|
Future Communications IC | 完全替代 |
AMPHENOL FCI 67997-210HLF 板至板连接器, 针座, 10路, 2排
|
|||
67997-210HLF
|
FCI Electronics | 完全替代 |
AMPHENOL FCI 67997-210HLF 板至板连接器, 针座, 10路, 2排
|
|||
67997-310HLF
|
FCI Electronics | 完全替代 |
集管和线壳 67997-310HLF-BS II DR
|
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