Technical parameters/access time: 5.5 ns
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 60
Encapsulation parameters/Encapsulation: TFBGA-60
External dimensions/packaging: TFBGA-60
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS42S16100F-7BL-TR
|
Integrated Silicon Solution | 类似代替 | BGA-60 |
16M, 3.3V, SDRAM, 1Mx16, 143MHz, 60 ball BGA (6.4mmx10.1mm) RoHS, T&R
|
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