Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M66256FP
|
Renesas Electronics | 功能相似 | SSOP |
5120个8位线存储器(FIFO ) 5120 x 8-BIT LINE MEMORY (FIFO)
|
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