Technical parameters/thermal resistance: 12 ℃/W
Technical parameters/thermal resistance (forced airflow): 12.00℃/W @500LFM
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/length: 25.00 mm
External dimensions/packaging: BGA
Physical parameters/materials: Aluminum
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
Customs information/HTS code: 8542900000
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
625-25ABT4
|
Wakefield Engineering | 完全替代 | BGA |
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
|
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