Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 36
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LTC1709EG-8#PBF
|
Linear Technology | 功能相似 | SSOP-36 |
开关稳压器 Hi Pwr PolyPhase DC/DC Controllers
|
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