Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8767902PC
|
Broadcom | 类似代替 | DIP-8 |
OPTOISO 1.5kV TRANS W/BASE 8DIP
|
||
5962-8767902PC
|
AVAGO Technologies | 类似代替 | DIP |
OPTOISO 1.5kV TRANS W/BASE 8DIP
|
||
HCPL-5530
|
AVAGO Technologies | 类似代替 | CDIP-8 |
Optocoupler DC-IN 2CH Transistor With Base DC-OUT 8Pin CDIP
|
||
HCPL-5530#200
|
AVAGO Technologies | 类似代替 | CDIP-8 |
高速光耦合器 2Ch 9MHz 1500Vdc Hermetically sealed
|
||
|
|
HP | 功能相似 |
Optocoupler DC-IN 2CH Transistor With Base DC-OUT 8Pin CDIP
|
|||
HCPL-5531
|
AVAGO Technologies | 功能相似 | CDIP-8 |
Optocoupler DC-IN 2CH Transistor With Base DC-OUT 8Pin CDIP
|
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