Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74AC125B
|
ST Microelectronics | 功能相似 | DIP |
四路总线缓冲器三态 QUAD BUS BUFFERS 3-STATE
|
||
74AC125PC
|
Fairchild | 功能相似 | DIP-14 |
FAIRCHILD SEMICONDUCTOR 74AC125PC 四缓冲器
|
||
74AC125PC
|
Rochester | 功能相似 | DIP |
FAIRCHILD SEMICONDUCTOR 74AC125PC 四缓冲器
|
||
74AC125PC
|
ON Semiconductor | 功能相似 | DIP-14 |
FAIRCHILD SEMICONDUCTOR 74AC125PC 四缓冲器
|
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