Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/height: 1.48 mm
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Network and Communication
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ATECC108-SSHDA-B
|
Microchip | 功能相似 | SOIC-8 |
EEPROM Serial-I2C 8.5Kbit 2.5V/3.3V/5V 8Pin SOIC Bulk
|
||
ATECC108-SSHDA-B
|
ATMEL | 功能相似 | SOIC-8 |
EEPROM Serial-I2C 8.5Kbit 2.5V/3.3V/5V 8Pin SOIC Bulk
|
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