Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LT1934IDCB#TRMPBF
|
Linear Technology | 功能相似 | DFN-6 |
降压型 Vin=3.2V~34V Vout=1.25V~29.92V 300mA
|
||
|
|
ADI | 功能相似 | DFN |
降压型 Vin=3.2V~34V Vout=1.25V~29.92V 300mA
|
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