Technical parameters/Contact electroplating: Gold, Tin Lead
Technical parameters/direction: Right Angle
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 6.47 mm
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Signal, Power
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review