Technical parameters/Contact electroplating: Gold, Gold over Nickel
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 12.24 mm
External dimensions/height: 1.78 mm
Physical parameters/contact material: Brass Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
3149-2-00-15-00-00-08-0
|
Mill-Max | 功能相似 |
CONN PC PIN CIRC 0.040DIA GOLD
|
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|
Mill-Max | 功能相似 | Through Hole |
Contact PIN Solder ST Thru-Hole Bulk
|
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