Chip AI consultant
Technical parameters/power supply voltage (DC): 3.00V (min)
Technical parameters/number of output interfaces: 3
Technical parameters/number of channels: 3
Technical parameters/number of pins: 48
Technical parameters/dissipated power: 1316 mW
Technical parameters/data rate: 1.43 Gbps
Technical parameters/number of inputs: 21
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 1316 mW
Technical parameters/power supply voltage: 3V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSSOP-48
External dimensions/length: 12.5 mm
External dimensions/width: 6.1 mm
External dimensions/height: 1.15 mm
External dimensions/packaging: TSSOP-48
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Other/Manufacturing Applications: Industry, signal processing, communication and networking, clock and timing
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/06/15
Customs information/ECCN code: EAR99
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN65LVDS95DGGREP
|
TI | 完全替代 | TSSOP-48 |
LVDS SERDES发送器 LVDS SERDES TRANSMITTER
|
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