Technical parameters/tolerances: ±2 %
Technical parameters/rated power: 1.13 W
Technical parameters/resistance: 6.8 KΩ
Technical parameters/resistance deviation: ±2 %
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 9
Encapsulation parameters/Encapsulation: SIP-9
External dimensions/length: 22.45 mm
External dimensions/width: 2.16 mm
External dimensions/height: 4.95 mm
External dimensions/packaging: SIP-9
Physical parameters/operating temperature: -55℃ ~ 125℃
Physical parameters/temperature coefficient: ±100 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: -
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
4309R-101-682
|
Bourns J.W. Miller | 完全替代 | SIP-9 |
Res Thick Film NET 6.8KΩ 2% 1.13W ±100ppm/℃ BUS Molded 9Pin SIP Pin Thru-Hole
|
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