Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-30
External dimensions/packaging: TSSOP-30
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPS5124
|
TI | 功能相似 | TSSOP-30 |
TPS5124 双通道同步步降 PWM 控制器
|
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