Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT70T653MS10BCG
|
Integrated Device Technology | 功能相似 | BGA-256 |
IC SRAM 18Mbit 10NS 256BGA
|
||
IDT70T653MS15BC
|
Integrated Device Technology | 功能相似 | BGA-256 |
HIGH -SPEED 2.5V 512K ×36异步双口静态RAM为3.3V 0R 2.5V接口 HIGH-SPEED 2.5V 512K x 36 ASYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V 0R 2.5V INTERFACE
|
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