Technical parameters/number of contacts: 180
Technical parameters/Contact electroplating: Gold
Technical parameters/number of rows: 2
Technical parameters/Flammability level: UL 94 V-0
Technical parameters/number of pins: 180
Encapsulation parameters/installation method: Surface Mount
Packaging parameters/pin spacing: 800 µm
External dimensions/length: 77.8 mm
External dimensions/width: 6.80 mm
External dimensions/height: 11.7 mm
External dimensions/pin spacing: 800 µm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -40℃ ~ 85℃
Physical parameters/shell material: Plastic
Other/Product Lifecycle: Active
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
52777-1878
|
Molex | 类似代替 |
0.8mm Pitch SlimStack™ Receptacle, Height 11.75mm, Tube Packaging, 180Circuits, with Metal Cover
|
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54137-1008
|
Molex | 功能相似 |
Board to Board & Mezzanine Connectors RECP SMT DUAL 100P
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|
FCI Electronics | 完全替代 |
板对板与夹层连接器 0.8MM B2B REC ASY
|
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61082-183602LF
|
Amphenol | 完全替代 |
板对板与夹层连接器 0.8MM B2B REC ASY
|
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