Technical parameters/Contact electroplating: Tin
Technical parameters/number of pins: 16
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 27.94 mm
External dimensions/width: 27.94 mm
External dimensions/height: 9.14 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -18℃ ~ 88℃
Physical parameters/shell material: Thermoplastic
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review