Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: D2PAK
External dimensions/packaging: D2PAK
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BT137B-600F,118
|
NXP | 功能相似 | TO-263-3 |
TRIAC 600V 8A(RMS) 71A 3Pin(2+Tab) D2PAK T/R
|
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