Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: QFP
External dimensions/packaging: QFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Embedded Design and Development
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/06/15
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