Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: CDIP
External dimensions/length: 37.2 mm
External dimensions/width: 15.2 mm
External dimensions/packaging: CDIP
External dimensions/thickness: 1.65 mm
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7206L25TPGI
|
Integrated Device Technology | 功能相似 | DIP-28 |
FIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, GREEN, PLASTIC, DIP-28
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review