Technical parameters/polarity: Female
Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: SMB
Packaging parameters/pin spacing: 180 µm
External dimensions/packaging: SMB
External dimensions/pin spacing: 180 µm
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
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