Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 12.5 mm
External dimensions/width: 6.1 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90CF562MTDX/NOPB
|
TI | 功能相似 | TSSOP-48 |
LVDS Flat Panel Display 0.45V 48Pin TSSOP T/R
|
||
DS90CF564MTD
|
TI | 功能相似 | TSSOP-48 |
LVDS 18位彩色平板显示器( FPD ) LinkΑ 65兆赫 LVDS 18-Bit Color Flat Panel Display (FPD) LinkΑ 65 MHz
|
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