Technical parameters/number of output interfaces: 2
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: -
External dimensions/length: 1.50 mm
External dimensions/width: 1.10 mm
External dimensions/packaging: -
External dimensions/thickness: 550 µm
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UPD5710TK
|
NEC | 功能相似 | SOT-563 |
IC 射频开关 UPD5710TK SOT-563 marking/标记 C3L
|
||
UPD5710TK-E2-A
|
Renesas Electronics | 功能相似 | Mini-Mold |
RF Switch SPDT 0MHz to 2.5GHz 22dB 6Pin LeadLess Mini-Mold T/R
|
||
|
|
Renesas Electronics | 完全替代 |
RF Switch SPDT 50MHz to 2500MHz 20dB 6Pin Mini-Mold
|
|||
UPG2012TK-E2-A
|
California Eastern Laboratories | 类似代替 | SMD-6 |
RF Switch SPDT 500MHz to 2.5GHz 24dB 6Pin LeadLess Mini-Mold T/R
|
||
|
|
Renesas Electronics | 类似代替 | Mini-Mold |
RF Switch SPDT 500MHz to 2.5GHz 24dB 6Pin LeadLess Mini-Mold T/R
|
||
|
|
California Eastern Laboratories | 功能相似 | PowerXDFN-6 |
RF Switch SPDT 500MHz to 3GHz 10dB 6Pin TSSON T/R
|
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