Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MSOP-8
External dimensions/packaging: MSOP-8
Other/Product Lifecycle: Supply in progress
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
INA2331
|
TI | 功能相似 |
低功耗单电源 CMOS 仪表放大器
|
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