Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
OPA2338UA
|
Burr Brown | 完全替代 | SOP |
CMOS 运算放大器,OPA 系列 ### 运算放大器,Texas Instruments
|
||
OPA2338UA
|
TI | 完全替代 | SOIC-8 |
CMOS 运算放大器,OPA 系列 ### 运算放大器,Texas Instruments
|
||
OPA2338UA/2K5G4
|
TI | 类似代替 | SOIC-8 |
MicroAmplifier 系列、双路 12.5MHz、微型、单电源 CMOS 运算放大器 8-SOIC -40 to 85
|
||
OPA2338UAG4
|
TI | 类似代替 | SOIC-8 |
OP Amp Dual GP R-R O/P 5.5V 8Pin SOIC Tube
|
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