Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8589-0861
|
Multicomp | 功能相似 |
MULTICOMP 8589-0861 射频/同轴适配器, 同轴混合系列, 直型转接器, SMA, 插座, N, 插头
|
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