Technical parameters/Contact electroplating: Tin Lead
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 12.67 mm
External dimensions/height: 4.74 mm
Physical parameters/contact material: Brass Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2804-4-00-01-00-00-07-0
|
Mill-Max | 完全替代 |
IC & Component Sockets 200u SN/PB OVER NI
|
|||
|
|
Mill-Max | 功能相似 | Bulk |
IC 与器件插座 200u SN OVER NI
|
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