Technical parameters/number of contacts: 28
Technical parameters/Contact electroplating: Tin
Technical parameters/insulation resistance: 5.00 GΩ
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Phosphor Bronze
Other/Product Lifecycle: Unknown
Other/Manufacturing Applications: Industrial, industry
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
110-44-328-41-001000
|
Mill-Max | 类似代替 | DIP |
MILL MAX 110-44-328-41-001000 芯片插座, DIP, 28脚, 通孔安装 直型
|
||
2227MC-28-06-07
|
Multicomp | 完全替代 |
MULTICOMP 2227MC-28-06-07 芯片和元件插座, 28 触点, 15.24 mm
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review