Technical parameters/Contact electroplating: Tin Lead
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 11.33 mm
Physical parameters/contact material: Brass Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2705-1-00-01-00-00-07-0
|
Mill-Max | 完全替代 |
IC 与器件插座 200u SN/PB OVER NI
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review