Technical parameters/RAM size: 282624 b
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Technical parameters/power supply voltage (Max): 1.26 V
Technical parameters/power supply voltage (Min): 1.14 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FPBGA-484
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.65 mm
External dimensions/packaging: FPBGA-484
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991.d
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFE2-20SE-5FN484C
|
Lattice Semiconductor | 完全替代 | FPBGA-484 |
FPGA LatticeECP2 Family 21000 Cells 90nm Technology 1.2V 484Pin FBGA
|
||
LFE2-20SE-6FN484C
|
Lattice Semiconductor | 完全替代 | FPBGA-484 |
FPGA - 现场可编程门阵列 21K LUTs 331 I/O S Series DSP 1.2V -6
|
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