Technical parameters/kernel architecture: dsPIC
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): -20 ℃
Physical parameters/weight: 90 g
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Embedded Design & Development, Embedded Design and Development
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Not applicable
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