Technical parameters/dissipated power: 1 W
Technical parameters/thermal resistance: 54 ℃/W
Technical parameters/thermal resistance (forced airflow): 25℃/W @200LFM
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: TO-5
External dimensions/length: 19.05 mm
External dimensions/height: 6.35 mm
External dimensions/diameter: 19.1 mm
External dimensions/packaging: TO-5
Physical parameters/color: Black
Physical parameters/materials: Aluminum
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standard/REACH SVHC version: 2015/12/17
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TXBF-032-025U
|
CTS | 功能相似 | TO-5 |
THERMAL LINK PRESSON TO-5
|
||
TXBF032025B
|
CTS | 功能相似 | TO-5 |
Heat Sink Passive TO-5 Thru-Hole Beryllium Copper 81.1℃/W Black Cadmium
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review