Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Not Recommended
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
25LC080A-E/SNG
|
Microchip | 功能相似 | SOIC-8 |
8K SPI总线串行EEPROM 8K SPI Bus Serial EEPROM
|
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